Molecular Interface Engineering with TRM for Enhanced Thermal Conductivity in Polymer Composites
발표자
임민우 (전북대학교)
연구책임자
정광운 (전북대학교)
초록
내용
Enhancing thermal conductivity in polymer composites requires more than just adding conductive fillers, and interfacial compatibility plays a crucial role. We introduce a newly designed tetrathiafulvalene-based reactive mesogen (TRM) that features an electron-rich aromatic structure, promoting strong molecular-level interactions with hexagonal boron nitride (BN) and expanded graphite (EG). These interactions effectively bridge the thermal gap between filler and matrix, facilitating phonon transport. Comprehensive characterization demonstrates that TRM incorporation leads to a significant increase in thermal conductivity. This result highlights the potential of molecularly engineered additives in overcoming interfacial limitations and provides a promising pathway toward high-performance, thermally conductive polymer systems for advanced thermal management applications. This work was supported by Mid-Career Researcher Program (RS-2021-NR059321) and BK21 FOUR program.