Development and Characterization of High Heat-Resistant Epoxy Prepreg for Semiconductor PCB Substrates
발표자
홍진건 (씨엔에이텍(주))
연구책임자
박명철 (씨엔에이텍(주))
초록
내용
A glass fiber-based prepreg is widely employed in semiconductor printed circuit board (PCB) substrates due to their superior insulating properties and cost-effectiveness. The thermal stability of the prepregs is a critical parameter, as it directly influences dimensional stability, interlaminar adhesion, and mechanical durability under high temperature processing conditions.
In this study, a high heat resistant epoxy resin system was developed to fabricate prepregs optimized for semiconductor PCB applications. Various resin formulations were systematically investigated to enhance not only thermal resistance but also key properties such as low dielectric constant and high adhesion strength. The resulting epoxy based prepregs exhibited excellent thermal and mechanical performance, demonstrating strong potential for application in high reliability semiconductor PCBs as well as in broader electronic and industrial composite material fields.