Mechanically Strong Epoxy-Based Covalent Adaptable Networks with Dual Dynamic Bonds for Shape-Programmable Electronic Substrates
발표자
이재혁 (부산대학교)
연구책임자
김채빈 (부산대학교)
초록
내용
Strong epoxy resin is a key material for PCB substrates due to its excellent strength, thermal stability, and electrical insulation. However, unlike thermoplastics, epoxy (or a thermoset) cannot be recycled because it lacks melt-processability. To overcome this, a new epoxy-based covalent adaptable network (CAN), crosslinked by dual-dynamic networks, has been developed. By adjusting monomer ratios, both dynamic and permanent crosslinking densities can be tailored, yielding heat-reprocessable CANs with high mechanical strength and thermal stability comparable to conventional bisphenol A epoxy. Additionally, the CAN can be depolymerized via base-catalyzed chemical recycling in heated water. Through its dual transition temperatures (Tg and Tv), CAN can be readily programmed to exhibit shape memory via Tg or shape fixation through dynamic bond exchange at Tv. This CAN matrix shows great potential as a recyclable composite matrix and a shape-reconfigurable PCB substrate for electronics.