Enhancing thermal and dielectric performance of PI-PDMS composites using silane-grafted AlN and KNN fillers
발표자
양시윤 (국립금오공과대학교)
연구책임자
정현민 (국립금오공과대학교)
초록
내용
Enhancing both thermal conductivity and dielectric properties of polymer composites is important for advanced electronic applications. In this study, a polyimide (PI)-polydimethylsiloxane (PDMS) matrix was reinforced with aluminum nitride (AlN) and potassium sodium niobate (KNN) fillers. Surface-treated AlN improved thermal conductivity up to 3.34 W/m·K, while KNN increased the dielectric constant to 300, though with slight thermal degradation. By optimizing the filler ratio, the PI-PDMS/(90AlN-GPTMS/10KNN) composite achieved 2.7 W/m·K in thermal conductivity and 30.1 in dielectric constant at 10 kHz. These results show that surface modification and filler composition control enable simultaneous improvement of thermal and dielectric performance. This work offers a practical strategy for developing PI-based composites with balanced properties suitable for electronic and thermal management applications.