Multiscale Filler-Integrated Smart Composites for High-Performance Multifunctionality
발표자
나진수 (서울대학교)
연구책임자
박주혁 (서울대학교)
초록
내용
Shape memory polymers (SMPs) hold great potential for adaptive and responsive systems, including soft robotics, wearable technologies, and biomedical devices. However, traditional SMPs are limited by weak mechanical properties, inadequate thermal transport, and poor electrical conductivity. To overcome these challenges, we developed hybrid composites using both micro-and nanofillers, to improve interfacial bonding and hierarchical networks. By systematically varying the filler ratios and analyzing their rheological responses, we explored percolation behavior correlated with multifunctional improvements. Consequently, the final formulations exhibited significant improvements in mechanical strength, electrical conductivity, and thermal transport. This study presents a scalable design strategy that integrates hierarchical filler engineering and rheological optimization to enable reliable, multifunctional SMP composites with tunable properties for advanced adaptive systems.