Silica Nanoparticles Functionalized with Oxidation Promoters for SiO₂ CMP
발표자
홍경오 (한남대학교)
연구책임자
김태동 (한남대학교)
초록
내용
To develop a surface-modified colloidal silica abrasive with high SiO2 film removal rates, we designed and synthesized a novel silane coupler, different from conventional surface modifiers used in CMP slurries. In this study, we introduced picolinic acid and nicotinoyl chloride as oxidation accelerators and silane linkers into the surface to perform chemical polishing on the surface of the silica polisher. This modification was aimed at enhancing the chemical interaction between the wafer and the abrasive during the CMP process, thereby improving polishing efficiency and selectivity. The morphology and particle size distribution of the surface-modified silica polisher were analyzed using scanning electron microscopy (SEM) and dynamic light scattering (DLS). In addition, the chemical structures of the synthesized oxidant-based silane coupler and the modified nanoparticles were confirmed by bio-nuclear magnetic resonance (¹H NMR) and infrared spectroscopy(IR).