[3PS-224]
Development of Functional Epoxy Monomers for Packaging Applications with Low Thermal Expansion and High Heat Resistance
발표자노혜경 (성균관대학교)
연구책임자송창식 (성균관대학교)
Abstract
With rising demand for high-performance electronic devices, semiconductor packaging is evolving toward finer, thinner, and more integrated structures. However, combining polymers with inorganic or metallic materials causes interfacial stress and warpage due to mismatches in the coefficient of thermal expansion (CTE). Conventional epoxy resins show high CTE, which remains a challenge. To address this, multifunctional epoxy monomers based on novolac and dicyclopentadiene (DCPD) novolac were synthesized. A Design of Experiments (DoE) method was used to optimize conditions for low CTE and high thermal stability by controlling repeating unit number and number-average molecular weight. Additionally, a resin with a rigid cardo-type fluorene structure was developed. This structure enhances thermal resistance, lowers CTE, and improves chemical, moisture, and dielectric performance. These epoxy systems provide a promising solution to ensure reliability in next-generation semiconductor packaging.