[1PS-194]
우수논문발표상 응모자Enhanced Mechanical Strength and Low-k Performance of Electrospun Polyimide Webs for Flexible Printed Circuit Board Materials
발표자채승훈 (충남대학교 유기응용재료공학과)
연구책임자정영규 (충남대학교 유기응용재료공학과)
Abstract
Electrospun polyimide (PI) nonwovens, characterized by high porosity, are promising materials for flexible printed circuit boards (FPCBs) due to their low dielectric constants. However, their limited mechanical strength hinders broader practical applications. In this study, PI nanofiber webs were fabricated via electrospinning and subjected to thermal compression using a hot press to control internal porosity. Poly(amic acid) precursors, synthesized from 4,4’-oxydiphthalic anhydride and 4,4’-oxydianiline, were electrospun, imidized, and compressed under various conditions. The structural, mechanical, and dielectric properties were evaluated using SEM, porosity measurement, tensile testing, and LCR analysis. Thermal compression effectively reduced excess porosity, resulting in enhanced tensile strength while retaining low dielectric constants due to the presence of residual air voids. This method offers low-k PI substrates with improved mechanical strength for FPCBs.