The Polymer Society of Korea

Abstract

 Currently, aromatic polyimide (PI) is in increasing demand in various industries such as semiconductor devices and automobiles due to its high tensile strength and excellent thermal stability. However, aromatic PI suffers from low tensile strain. To overcome this limitation, many studies have attempted to enhance the tensile strain by incorporating highly flexible polydimethylsiloxane (PDMS) into the polymer. While PDMS improves flexibility, it also reduces tensile strength due to weakened intermolecular interactions. To address this issue, a crosslinking strategy was adopted in this study. Various polyimide films were prepared by adjusting the molar equivalence of the crosslinking agent. The chemical structure of the synthesized PI was analyzed using H-NMR and FT-IR spectroscopy, and the thermal and mechanical properties of the films were evaluated using TGA, DSC, and UTM.