[3PS-175]
Developing High-Thermal-Conductivity Epoxy Composites: Using Hybrid Fillers of Silica Nanowires and Core–Shell Nanoparticles
발표자박민아 (인하대학교 )
연구책임자심상은 (인하대학교)
Abstract
As electronic devices become more integrated, thermal management is essential for reliability. However, epoxy resins have low thermal conductivity, limiting use in high-power systems. Silica is a good filler for its insulation and stability, but its poor thermal conductivity is a drawback. To address this, silica nanoparticles were coated with alumina via a sol–gel process to form core–shell structures, enhancing interfacial heat transfer. These were combined with silica nanowires to create a hybrid filler system. This design forms multidimensional thermal pathways in the epoxy matrix, improving heat conduction while retaining insulation. Future work includes optimizing filler ratios and applying alumina coatings to nanowires. The approach holds promise for electronic packaging and thermal interface materials.