The Polymer Society of Korea

Abstract

As device integration density increases and feature sizes shrink, issues such as capacitive coupling (cross-talk), RC delay, and power dissipation become more pronounced, emphasizing the need for insulating materials with low dielectric constants. Polyimide (PI) is a promising candidate due to its excellent thermal and mechanical stability; however, conventional PI often exhibits a relatively high dielectric constant. In this study, we designed and synthesized four types of PI-based polymers by structurally modifying the polymer backbone to lower the dielectric constant. Structural modifications were achieved by incorporating rigid and low-polarity units, including spiro-type structures, which effectively suppress dipolar polarization and increase free volume. The synthesized polymers were characterized using NMR and FT-IR for structural analysis, DSC and TGA for thermal properties, GPC for molecular weight distribution, and dielectric constant measurements.