[2PS-195]
Preparation of Core–Shell MWCNT Fillers Using Ceramic Coating for Epoxy Composite Systems
발표자임민혁 (인하대학교)
연구책임자김승현 (인하대학교)
Abstract
As advanced semiconductors like high-bandwidth memory (HBM) and IoT devices become more compact, thermal management is critical for reliability. The thermal conductivity of packaging materials affects semiconductor lifespan, increasing demand for better heat dissipation. Epoxy resin, commonly used in packaging, has low thermal conductivity (~0.22 W/m·K), so ceramic, metal, and carbon-based fillers are added.
Multiwalled carbon nanotubes (MWCNTs) are promising due to high thermal conductivity and efficiency at low content. However, their electrical conductivity and poor dispersion limit use in insulating applications.
To address this, MWCNTs were coated with ceramic materials such as Al₂O₃, SiO₂, and TiO₂, forming core–shell structures that improve insulation while retaining thermal performance. The coated MWCNTs were analyzed by SEM and TEM, and their thermal and electrical properties were evaluated.