[2PS-136]
Hybrid 2D Nanostructure Films of Copper and Silver for Enhanced Electromagnetic Interference Shielding
발표자오상헌 (전북대학교)
연구책임자김태욱 (전북대학교)
Abstract
Two-dimensional (2D) copper nanosheets have emerged as promising conductive fillers for high-performance EMI shielding films. However, their practical use is limited by the need for high-temperature annealing to establish electrical percolation, which restricts compatibility with low-temperature substrates. To overcome this limitation, hybrid films composed of 2D Cu and Ag nanosheets (Ag NSs) were developed. Ag NSs provide superior conductivity and sinterablility at lower temperatures, enabling robust conductive networks.
In this study, we systematically investigated the effects of Cu/Ag composition on film morphology, electrical conductivity, and EMI shielding effectiveness. By varying the mixing ratio and annealing temperature, key relationships between internal microstructure and performance were revealed. The optimized Cu/Ag film exhibited excellent EMI shielding under low-temperature conditions, showing strong potential for flexible and high-frequency electronic applications.