POS1-1141
Vapor-Deposited Polyimide Thin Films via Copolymerization of Functionalized Parylene Dimers
When and Where
Nov 30, -0001
12:00am - 12:00am
Presenter(s)
Son Chaeyeong (Chungnam National University)
Co-Author(s)
Abstract
Polyimides have attracted significant attention as high-performance polymeric materials owing to their exceptional thermal stability, mechanical strength, chemical resistance, low dielectric loss, and excellent electrical insulation properties. These outstanding characteristics have enabled their widespread use in flexible electronics, microelectronics, dielectric layers, and protective coatings. However, conventional solution processing of polyimide thin films typically requires high boiling organic solvents and multiple processing steps, which can result in solvent residues, poor thickness uniformity, and limited conformal coverage on complex three-dimensional structures. In addition, achieving ultrathin polyimide films with precise thickness control remains challenging using conventional wet processing techniques. Therefore, solvent-free method for preparing uniform and conformal polyimide thin films is needed. In this study, parylene chemical vapor deposition was used because it provides uniform film growth, precise thickness control, and flexibility in precursor functionalization. Dianhydride-functionalized parylene and two amine-functionalized parylene dimers were synthesized and used as precursors for vapor-phase copolymerization. Co-deposition of the functionalized dimers produced amic-acid-parylene copolymer films, which were subsequently converted into imide structures by thermal treatment. The chemical structure, thermal stability, dielectric properties, and film characteristics were examined to assess the applicability of the deposited films to flexible electronic devices
