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Program Scientific Program
POS1-0877

Depolymerizable Polyurethane Hot-Melt Adhesives for Controlled Debonding

When and Where

Nov 30, -0001
12:00am - 12:00am

Presenter(s)

Yewon Kang (CHONNAM NATIONAL UNIVERSITY)

Co-Author(s)

Hyungwoo Kim (CHONNAM NATIONAL UNIVERSITY)

Abstract

Adhesives facilitate the assembly of multi-material products but often hinder the selective separation and recovery of their constituent materials after use. In particular, removing conventional hot-melt adhesives (HMAs) may require heating, harsh solvents, or mechanical force, potentially causing substrate damage and reducing the quality of recovered materials. To address these limitations, we developed a polyurethane (PU) HMA that maintains adhesion during use while undergoing backbone depolymerization in response to a specific chemical stimulus, thereby enabling selective debonding at room temperature.
The resulting PU was processed into a flexible, low-tack film suitable for convenient handling and thermal bonding. Exposure to fluoride induced backbone depolymerization and loss of adhesion, enabling the separation of mixed plastics and the dismantling of carbon-fiber-reinforced polymer assemblies. The recovered depolymerization products were subsequently converted into an upcycled polyurea that formed a flexible, free-standing film, demonstrating the potential for further utilization of the recovered polymer components.
By integrating selective debonding, component recovery, and chemical reuse of the depolymerization products, this study presents a circular adhesive strategy that supports both product disassembly and continued material utilization.
 
Supported by
Korea Tourism Organization BUSAN TOURISM ORGANIZATION
Sponsored by
Sejin CI DONGJIN SEMICHEM HAEDONG SCIENCE FOUNDATION COSMAX EcoProBM Young Eng. Sci. Doosan SAMSUNG SDI S-OIL 한국도레이과학진흥재단